New Release! MT-FIMMPROP
This industry shifting optional addition to FIMMPROP allows for multiple EME simulations to be
combined natively in a schematic layout environment to design, simulate, and export entire PIC devices with a single tool.
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OMNISIM 8.0 comes with a significantly
faster FETD engine with Hybrid mesh, upgraded 3D CAD
Interface supporting extrusion of 2D to 3D shapes
for creating tapered waveguides, arbitrarily rotated
3D shapes, and real-time 3D view of the unprocessed
device during the design stage.
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EPIPPROP 3.4.
This update includes: New process type ‘Etch & Fill’ allows for more flexible waveguide geometry.
Layer thicknesses can now have random variations defined by an import file.
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